We know the trends of production. We can produce high quality HDI board (High Density Interconnect PCB) in extraordinary time and top quality.
Even in the production of HDI PCBs we use the latest technologies such as filling, measured impedance, via-in-pad, HF materials, or production in IPC class 3 standard. Lamination 3+N+3, BGA min. 0.4 mm, burried vias, blind vias (0.15 mm drill), aspect ratio 1:1. For the motif and mask we use high-tech MDI (Micromirror Digital Imaging) technology.
Please enter your customized PCB request into our configurator for the fastest price quotation