The field of electronics is advancing continuously, driving the miniaturization of electronic devices. This trend brings increasingly demanding requirements for the design and manufacturing of printed circuit boards (PCBs), which must be smaller, harder to access, and capable of handling higher component densities. This article focuses on design rules for small PCBs and their application potential.
With growing demands for smaller devices such as smartphones, wearable electronics, or miniaturized industrial solutions, PCBs are being forced to shrink in size while maintaining performance and reliability. This downsizing can reduce the product’s size to half or even one-third of the original PCB dimensions.
Miniaturization not only involves reducing the PCB size but also finer trace widths, smaller vias, and significantly advanced processing technologies. These changes pose challenges for designers as well as manufacturers, who must keep up with technological trends such as microvias, fine traces, and advanced laminates.
Modern technologies include improved methods for depositing copper on the board surface, enhancing adhesion for micro traces. Technologies like buried and blind vias further increase the routing possibilities between layers.
Another significant advancement is pattern plating, which eliminates the need to remove excess traces outside the circuit and ensures better connectivity between individual layers.
Miniaturized PCBs find applications across various industries:
The miniaturization of printed circuit boards is essential for the continued evolution of electronics. Advances in design and manufacturing open doors to higher component densities, greater reliability, and smaller device sizes.