PCB manufacturing technology
Every year we invest heavily in the best PCB manufacturing technologies. In order to meet our customers' expectations for quality, reliability, flexibility, innovation and speed. We make customized PCBs in sophisticated hi-tech production plant in Boskovice. Take a look at the facilities in which your PCBs are manufactured.
Penta - HAL lead free
A traditional PCB surface treatment that continues to find significant application despite its limitations is HAL (Hot Air Solder Levelling). Gatema PCB offers both HAL with lead solder (Pb37Sn63) and ROHS compliant tin solder (Sn99+). The solder is regularly regenerated and its composition is verified by OES directly at the supplier.
PPT - Immersion Silver
Immersion silver has best usage in HF applications. Because of missing Nickel is ideal for high frequency signals. Silver is better conductor than Au or Cu. It is easily solderable finish - IAg thickness is only 0,1 µm so even flatless is great. Because of this characteristics it is commonly used for high construction classes of the printed boards too.
PPT Trenčianská Teplá - ENIG
Gold is an ideal element for top PCB cover. Given that gold doesn´t form oxides, the temperature and storage conditions have nearly no effect on its durability or condition compared to other finishes. Excellent adhesion is result of practically instant dissolution of gold into the solder. Nickel layer needs to be coated between copper and gold layers to prevent their mixing and therefore causing problems with soldering. This finish is suitable for AI wire bonding.
PPT Trenčianská Teplá - chemical tin
Chemical tin bath excludes thin and even layer of pure tin selectively on copper surface and in plated holes. Tin layer acquired by this process meets all modern final PCB´s finish requirements.
PPT Trenčianská Teplá - galvanic Ni/Au
During the process is applied cca 5-10 um of glavanic nickel and 1-3 um of galvanic gold. In this case we talk about so-called hard gold. Galvanic gold is mostly used for protection from direct contact of connectors.