PCB manufacturing technology

Every year we invest heavily in the best PCB manufacturing technologies. In order to meet our customers' expectations for quality, reliability, flexibility, innovation and speed. We make customized PCBs in sophisticated hi-tech production plant in Boskovice. Take a look at the facilities in which your PCBs are manufactured.

Technologie

CAM software

Technologie

CNC

Technologie

Clean Room

Technologie

Wet processes

Technologie

Multilayer press

Technologie

Surface finishing

Technologie

Testing

Technologie

Neutralization

Wet processes

WISE - brushing

WISE - brushing

WISE - brushing

Within the PCB production a brushing line is used for removal of burr from holes and oxidation from copper surfaces. The line is equipped with an automatic brush pressure setting and high pressure rinsing.

Plasonic - plasma

Plasonic - plasma

Plasonic - plasma

Plasma treatment removes resin from walls of drilled holes to allow perfect connection of galvanic copper on PCB internal layers. This method is convenient either for standard FR4 materials and for advanced materials with higher Tg, halogen free, polyimide (flex, rigid-flex), PFE etc. as well

Laif - direct plating

Laif - direct plating

Laif - direct plating

The process of direct plating is based on graphite layer deposit on PCB dialectric surface which are to be plated through with galvanic copper. It is essential process verified by long-term operation.

Matusewitz - chemical cleaning

Matusewitz - chemical cleaning

Matusewitz - chemical cleaning

Matusewitz MECetch line - this process replaces the brushing process in some areas. It brings far greater copper roughness and therefore it´s bigger surface. This treatment is suitable for application with dry resist, solder mask even for finishes pre-treatment. This technology is used also for copper surface treatment for flexi PCBs thanks to its minimal mechanical stress. Modern line software enables flexible program setting and simultaneously controls the automatic dosing based on continuous copper measurement.

Laif - resist developer

Laif - resist developer

Laif - resist developer

After dry resist exposure future connections are developed. This means that not imaged areas of photo sensitive material are chemically removed in sodium carbonate solution.

Schmid - solder mask developer

Schmid - solder mask developer

Schmid - solder mask developer

Not imaged surfaces of solder mask are removed by developing process.

PPT Trenčianská Teplá - galvanic line

PPT Trenčianská Teplá - galvanic line

PPT Trenčianská Teplá - galvanic line

Galvanic line serves for plating-through of holes and copper thickening to required thickness and it represents core process of PCB production. The line contains acid copper and galvanic tin baths

Wise - dry resist stripper

Wise - dry resist stripper

Wise - dry resist stripper

The new line, from the Italian company WISE, is equipped with an automatic mode of control and dosing of chemicals.

Schmid - acid etching

Schmid - acid etching

Schmid - acid etching

Excess copper is removed from PCB by using copper dichloride solution. The system itself measures bath selected parameters and upon results adds necessary chemicals.

Laif - alcalic etching

Laif - alcalic etching

Laif - alcalic etching

Ammoniacal etchant removes excess copper from PCB. The process itself controls solution pH value and density.

Schmid - copper pre-treatment

Schmid - copper pre-treatment

Schmid - copper pre-treatment

V-Bond is suitable for treatment of internal layers before pressing. Unique surface topography formed by V-Bond improves adhesion of resin to copper.

Cehmcu - tin stripper

Cehmcu - tin stripper

Cehmcu - tin stripper

Serves for removal of tin as protective resist before etching.